Through-Hole Assembly Services – THT PCB Assembly
Through-Hole Assembly Manufacturing Advantage
In-house Integration
Complete in-house through-hole assembly capabilities from component insertion to wave soldering, ensuring quality control at every stage.
Advanced Equipment
State-of-the-art wave soldering and selective soldering equipment for reliable through-hole solder joints.
Multiple Assembly Methods
Wave soldering, selective soldering, hand soldering, and press-fit technology to suit different component and production requirements.
Through-Hole Assembly Production Excellence
Wave Soldering
Efficient wave soldering for standard through-hole components in production runs with consistent solder joint quality.
Selective Soldering
Precision selective soldering for mixed-technology boards where only specific through-hole parts need soldering.
Press-Fit Technology
Press-fit technology for connector insertion without solder, providing replaceable connections with excellent mechanical strength.
Hand Soldering
Expert hand soldering for prototype boards, odd-form components, and repair work requiring manual precision.
Through-Hole Assembly Manufacturing Capability
| Specification | Our Capability |
| Board Size | 50mm x 50mm to 510mm x 460mm |
| Board Thickness | 0.8mm to 6.0mm |
| Min Hole Diameter | 0.3mm (mechanical drill) |
| Max Lead Diameter | 3.2mm |
| Component Height | Up to 70mm |
| Pitch Spacing | 0.5mm to 2.54mm (standard) |
| Solder Type | Lead-free (SAC305) or leaded (63/37) |
Quality Control of Through-Hole Assembly
Quality Control Equipment
- Automatic Optical Inspection (AOI)
- X-ray Inspection
- Visual Inspection
- ICT (In-Circuit Testing)
Quality Standard Certificates
- ISO 9001:2015
- IPC Class 2/3
- IATF 16949 (automotive)
- UL Certification
Through-Hole Assembly Application
- Connectors: USB, HDMI, D-SUB, headers, terminal blocks
- Power Components: Transformers, inductors, electrolytic capacitors
- Electromechanical: Relays, switches, DIP switches, fuses
- Precision Components: Crystal oscillators, axial/radial capacitors
- Large ICs: DIP packages, sockets
Through-Hole Assembly FAQ
When should I use through-hole instead of surface mount components?
Through-hole components are preferred for applications requiring strong mechanical bonds, high current carrying capacity, or easy replacement. They are ideal for connectors, transformers, and components subject to mechanical stress.
Can you do mixed SMT and through-hole assembly on the same board?
Yes, we regularly produce mixed-technology boards. SMT components are assembled first, followed by through-hole insertion and wave or selective soldering.
Through-Hole Assembly Solutions
Read our technical articles about through-hole assembly best practices and mixed technology manufacturing guidelines.