SMT Assembly Services – Surface Mount Technology Manufacturing
SMT Assembly Manufacturing Advantage
In-house Integration
Complete in-house SMT assembly capabilities from solder paste printing to AOI inspection, ensuring quality control at every stage.
Advanced Equipment
Fuji NXT III pick-and-place machines, DEK solder paste printers, and Vitronics Soltec reflow ovens for precision assembly.
High-Mix, Low-Volume
Extensive experience handling high-mix, low-volume SMT orders with quick turnaround for prototype and pre-production runs.
SMT Assembly Production Excellence
Solder Paste Printing
Precision solder paste printing with SPI verification to ensure correct paste deposition before component placement.
Component Placement
High-speed precision placement up to 45,000 CPH with +/-0.03mm accuracy for components down to 0201 and 01005.
Reflow Soldering
Lead-free reflow soldering (SAC305) with precise temperature profiling for reliable solder joints and minimal thermal stress.
AOI & X-ray Inspection
100% AOI inspection after reflow and X-ray inspection for BGA and QFN hidden solder joints.
SMT Assembly Manufacturing Capability
| Specification | Our Capability |
| Min Component Size | 0201 (0.25mm x 0.125mm), 01005 available |
| BGA / CSP Pitch | 0.35mm and above |
| QFN / QFP Pitch | 0.3mm and above |
| Placement Accuracy | +/-0.03mm |
| Placement Speed | 45,000 CPH |
| Solder Type | Lead-free (SAC305), Leaded available |
| Max Board Size | 510mm x 460mm |
| Max Component Height | 25mm top / 6mm bottom |
Quality Control of SMT Assembly
Quality Control Equipment
- Solder Paste Inspection (SPI)
- Automatic Optical Inspection (AOI)
- X-ray Inspection for BGA/QFN
- First Article Inspection (FAI)
Quality Standard Certificates
- ISO 9001:2015
- IPC Class 2/3
- IATF 16949 (automotive)
- UL Certification
SMT Assembly Application
- Consumer Electronics: Smartphones, tablets, IoT devices
- Automotive ECUs: ADAS, infotainment, powertrain control
- Industrial Control: PLCs, motor drives, automation controllers
- Medical Devices: Diagnostic equipment, patient monitors
- Communication Equipment: 5G, routers, base stations
SMT Assembly FAQ
What is the minimum component size you can assemble?
We can assemble components down to 0201 (0.25mm x 0.125mm). 01005 components are available for high-density designs with proper DFM review.
Do you offer lead-free and leaded solder options?
Yes, we offer both lead-free (SAC305) and leaded (Sn63Pb37) solder options. Lead-free is standard for RoHS compliance; leaded is available for non-RoHS applications.
SMT Assembly Solutions
Read our technical articles about SMT assembly best practices and design for manufacturing (DFM) guidelines.